Coherent Opens a New AI Revenue Opportunity Beyond Optics

Coherent is finding another way to monetize the AI infrastructure boom.
$COHR has begun sampling its 300mm high-thermal-conductivity silicon carbide substrates with leading AI semiconductor partners.
The opportunity sits outside Coherent’s better-known optical networking business.
As next-generation AI processors push power density higher, removing heat is becoming one of the biggest constraints on performance, reliability and datacenter efficiency.
Coherent says its new SiC substrates can improve heat spreading by up to 25% compared with current solutions while remaining compatible with existing semiconductor manufacturing platforms.
That potentially puts $COHR deeper into the advanced packaging and thermal-management layer of the AI supply chain.
And that layer is becoming increasingly important as AI accelerators and custom silicon continue scaling in power and complexity.
The same trend is also drawing attention toward companies like $AMKR.
Amkor is building advanced packaging and test capacity in Arizona and has signed a 10-year partnership with $TSM, creating a more integrated U.S. supply chain from leading-edge wafer fabrication to packaged and tested chips.
The AI trade is expanding beyond GPUs.
Optics, thermal materials and advanced packaging are becoming critical infrastructure too.