Samsung Reportedly Plans to More Than Double HBM4 and HBM4E Capacity Next Year

Samsung reportedly plans to more than double its HBM4-series manufacturing capacity next year to accelerate output for advanced memory hardware.
The company is scaling outsourced glass-carrier cleaning throughput from 20,000 pieces per month this year to 50,000 pieces per month next year.
The planned operational expansion encompasses both HBM4 and HBM4E lines and could support at least a two-fold increase in total production output.