Samsung Reportedly Plans to Use $TSM's 3nm Process for $NVDA's Next-Gen Custom HBM Chips

Samsung Electronics reportedly plans to use $TSM's 3nm process for $NVDA's next-generation custom HBM chips, marking their first HBM production collaboration.
Nvidia is requiring Samsung, SK Hynix ($SKHY) and Micron ($MU) to adopt TSMC's 3nm process for NVHBM base dies and sixth-generation DRAM for core dies.
Samsung reportedly accepted the requirements but will continue producing other HBM products internally. Its own foundry could serve as a potential backup if TSMC capacity becomes constrained.