ASML Customers Seek Chipmaking Equipment Through 2030 as High-NA EUV Advances

ASML $ASML says semiconductor manufacturers are already discussing equipment orders for 2029 and 2030 as AI infrastructure investment drives demand beyond current production capacity.
CEO Christophe Fouquet highlighted progress in High-NA EUV lithography, with Samsung targeting mass production in 2028 and TSMC around 2030. Intel is already expanding its use of the technology across additional chip layers.
ASML also plans to introduce its NXE:3800F system in 2027, increasing throughput from 230 to 260 wafers per hour. These developments could support advanced chip production, although deployment schedules remain subject to execution risks.