TSMC Reportedly Prepares 10-20% CoWoS Price Hike Amid Squeezed AI Packaging Capacity

Taiwan Semiconductor Manufacturing Company ($TSM) is reportedly preparing to raise its Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging prices by 10% to 20% as relentless artificial intelligence demand continues to strain production lines, according to Taiwan’s *Commercial Times*.
Major high-performance computing leaders—including Nvidia ($NVDA), AMD ($AMD), and Broadcom ($AVGO)—are the primary drivers behind the bottleneck. Meanwhile, packaging and testing partners ASE Technology ($ASX) and Amkor ($AMKR) are aggressively scaling their own capacities to absorb overflow demand.
TSMC’s proprietary CoWoS capacity is projected to exceed 130,000 wafers per month by the end of 2026 and scale toward 200,000 wafers per month by 2027, with multi-year expansion roadmaps extending through 2031 to support next-generation AI architectures.